Wax for Bonding Electronic Components
The electronic component bonding wax is developed specifically for electronic manufacturing processes. It is formulated with refined wax and functional additives, and has the functions of bonding, fixing, and temporary fixation. It is suitable for electronic component assembly, surface mount, and encapsulation processes.
Used in the grinding and processing of quartz wafers and single-crystal silicon wafers, as well as in the bonding of precision glass and metals.
Performance
Strong adhesion
Good thermal stability and low melting temperature
Non-toxic, free of impurities, and non-corrosive.
Easily dissolved and cleaned by organic solvents
